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| 1 motorola sensor device data
"# !" " !!# ! ! the MPX2100 series device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output e directly proportional to the applied pressure. the sensor is a single, monolithic silicon diaphragm with the strain gauge and a thinfilm resistor network integrated onchip. the chip is laser trimmed for precise span and offset calibration and temperature compensation. features ? temperature compensated over 0 c to +85 c ? easytouse chip carrier package options ? available in absolute, differential and gauge configurations ? ratiometric to supply voltage ? 0.25% linearity (MPX2100d) application examples ? pump/motor controllers ? robotics ? level indicators ? medical diagnostics ? pressure switching ? barometers ? altimeters figure 1 illustrates a block diagram of the internal circuitry on the standalone pressure sensor chip. figure 1. temperature compensated pressure sensor schematic * '
'"' " !"( ( " ! (!$&()& #!$"'( #" " &( #" &) (&- * 354 * 354 " voltage output versus applied differential pressure the differential voltage output of the sensor is directly proportional to the differential pressure applied. the absolute sensor has a builtin reference vacuum. the output voltage will decrease as vacuum, relative to ambient, is drawn on the pressure (p1) side. the output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure (p1) side relative to the vacuum (p2) side. similarly, output voltage increases as increasing vacuum is applied to the vacuum (p2) side relative to the pressure (p1) side. order this document by MPX2100/d
semiconductor technical data ? motorola, inc. 2002 0 to 100 kpa (0 to 14.5 psi) 40 mv full scale span (typical) unibody package MPX2100ap/gp case 344b MPX2100asx/gsx case 344f MPX2100a/d case 344 MPX2100dp case 344c pin number 1 2 gnd +v out 3 4 v s v out note: pin 1 is noted by the notch in the lead. rev 9 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 2 motorola sensor device data maximum ratings (note) rating symbol value unit maximum pressure (p1 > p2) p max 400 kpa storage temperature t stg 40 to +125 c operating temperature t a 40 to +125 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 10 vdc, t a = 25 c unless otherwise noted, p1 > p2) characteristic symbol min typ max unit pressure range (1) p op 0 e 100 kpa supply voltage (2) v s e 10 16 vdc supply current i o e 6.0 e madc full scale span (3) MPX2100a, MPX2100d v fss 38.5 40 41.5 mv offset (4) MPX2100d MPX2100a series v off 1.0 2.0 e e 1.0 2.0 mv sensitivity d v/ d p e 0.4 e mv/kpa linearity (5) MPX2100d series MPX2100a series e e 0.25 1.0 e e 0.25 1.0 %v fss pressure hysteresis (5) (0 to 100 kpa) e e 0.1 e %v fss temperature hysteresis (5) (40 c to +125 c) e e 0.5 e %v fss temperature effect on full scale span (5) tcv fss 1.0 e 1.0 %v fss temperature effect on offset (5) tcv off 1.0 e 1.0 mv input impedance z in 1000 e 2500 w output impedance z out 1400 e 3000 w response time (6) (10% to 90%) t r e 1.0 e ms warmup e e 20 e ms offset stability (7) e e 0.5 e %v fss notes: 1. 1.0 kpa (kilopascal) equals 0.145 psi. 2. device is ratiometric within this specified excitation range. operating the device above the specified excitation range may i nduce additional error due to device selfheating. 3. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. offset (v off ) is defined as the output voltage at the minimum rated pressure. 5. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? tcspan: output deviation at full rated pressure over the temperature range of 0 to 85 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 c, relative to 25 c. 6. response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when s ubjected to a specified step change in pressure. 7. offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling with bias test. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 3 motorola sensor device data linearity linearity refers to how well a transducer's output follows the equation: v out = v off + sensitivity x p over the operating pressure range. there are two basic methods for calculating nonlinearity: (1) end point straight line fit (see figure 2) or (2) a least squares best line fit. while a least squares fit gives the abest caseo linearity error (lower numerical value), the calculations required are burdensome. conversely, an end point fit will give the aworst caseo error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. motorola's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. figure 2. linearity specification comparison '( '%)& * ( #" & ( **# ( #)($)( $&'')& ) ' " $# "( '(& ( " ( , &( $& #&!" )&* '( '%)&' ( '(& ( " * ( #" # '( onchip temperature compensation and calibration figure 3 shows the output characteristics of the MPX2100 series at 25 c. the output is directly proportional to the differential pressure and is essentially a straight line. the effects of temperature on full scale span and offset are very small and are shown under operating characteris- tics. figure 3. output versus pressure differential figure 4. crosssectional diagrams (not to scale) #)($)(2*0/ 1$. $' 6 '$" &" (-$ # '( (-$ (-$ ! " * ' *0/ ( $ $ !, ' #" #( + & #" &! &"( ) '( " '' '( !( #*& $#,- ' &"( ) !"( #" ' #" #( + & #" &! '# )( '( " '' '( !( #*& $#,- ' #" '# )( !"( $ $ $ $ figure 4 illustrates the absolute sensing configuration (right) and the differential or gauge configuration in the basic chip carrier (case 344). a silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. the MPX2100 series pressure sensor operating charac- teristics and internal reliability and qualification tests are based on use of dry air as the pressure media. media other than dry air may have adverse effects on sensor perfor- mance and long term reliability. contact the factory for in- formation regarding media compatibility in your application. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 4 motorola sensor device data pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing the silicone gel which isolates the die. the differential or gauge sensor is designed to operate with positive differential pressure applied, p1 > p2. the absolute sensor is designed for vacuum applied to p1 side. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier MPX2100a MPX2100d 344 stainless steel cap MPX2100dp 344c side with part marking MPX2100ap MPX2100gp 344b side with port attached MPX2100asx MPX2100gsx 344f side with port attached ordering information MPX2100 series pressure sensors are available in absolute, differential and gauge configurations. devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections. mpx series device type options case type order number device marking basic element absolute, differential 344 MPX2100a MPX2100d MPX2100a MPX2100d ported elements differential, dual port 344c MPX2100dp MPX2100dp absolute, gauge 344b MPX2100ap MPX2100gp MPX2100ap MPX2100gp absolute, gauge axial 344f MPX2100asx MPX2100gsx MPX2100a MPX2100d f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 5 motorola sensor device data package dimensions case 34415 issue z '(- $ " &#)" #)($)( ')$$ - #)($)( '(- $ " * ')$$ - ')$$ - &#)" ! ! ( pin 1 r n l g f d 4 pl t c m j b a ' ' "#! "#! "#(' !"' #" " " (# &" " $& '! - ! #"(&# " !"' #" " !"' #" ' " )' * # ( !# '(#$ & " !# '(#$ & " "#( (# , '(- $ " " *#)( *' *#)( dambar trim zone: f this is included within dim. afo 8 pl y z case 344b01 issue b '(- $ " &#)" #)($)( ')$$ - #)($)( b n r c j t d f u h l port #1 positive pressure pin 1 a q s k g 4 pl p ' % ! ( ' ' ! % ' ( "#(' !"' #" " " (# &" " $& "' - #"(&# " !"' #" " ' ' ' ' (p1) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 6 motorola sensor device data package dimensions e continued case 344c01 issue b '(- $ " &#)" #)($)( ')$$ - #)($)( port #2 port #1 port #2 vacuum k s w h l u f g d port #1 positive pressure q pin 1 4 pl p t t ' % ! ( ' ' ! % ' ( b n j c v r "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " ' ' ' ' a (p2) (p1) case 344f01 issue b "#(' !"' #" " " (# &" " $& "' - ! #"(&# " !"' #" " '(- $ " &#)" * #)( * ')$$ - * #)( e c j v t port #1 positive pressure pin 1 4 pl d p g k ! % ! ( u a f s n b ' $ ! % ' ( ' ' q r (p1) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 7 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 8 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation o r guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the applicati on or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for e ach customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications int ended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or dea th may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its o fficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleg es that motorola was negligent regarding the design or manufacture of the part. motorola and the stylized m logo are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. motorola and the stylized m logo are registered in the us patent & t rademark office. all other product or service names are the property of their respective owners. motorola, inc. 2002. how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 japan : motorola japan ltd.; sps, technical information center, 3201, minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong ko ng. 85226668334 technical information center: 18005216274 home page : http://www.motorola.com/semiconductors/ MPX2100/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . archived by freescale semiconductor, inc. 2005 archived by freescale semiconductor, inc. 2005 |
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